Intel plans to build Quelcom chips to capture its core competitors by 2025

July 26 (Reuters) – Intel Corps (INTC.O) said on Monday that the factories would begin building Qualcomm Inc (QCOM.O) chips and pave the way for a new mining business to catch up with competitors such as Taiwan’s semiconductor manufacturing co. 2330.TW) and Samsung Electronics Co. Ltd. (005930.KS). In 2025. Inc. (AMZN.O), another technology leader in the production of high-speed and fast-paced computer chips for five years, will be another new customer for the chip business.

But Intel has lost that lead. TSMC and Samsung, whose manufacturing services have outperformed their competitors Intel’s advanced micro-devices Dec. Inc (AMD.O) and Nvidia Corp (NVDA.O) helped produce chips that were more efficient than Intel. AMD and Nvidia Design chips were later developed by rival chip manufacturers, the foundations.

Intel On Monday, he announced that he would re-emerge as the leader in 2025, and outlined five acceleration technologies that will begin over the next four years.

The most advanced is Intel’s first new design for transistors, transistors, transistors and transistors in ten years. From 2025 onwards, the ASML.AS will affect a new generation of silicon-based machines, such as the printing of a new generation photograph called ultraviolet lithography.

“We are giving the full details to the public to hold us accountable,” said Intel CEO Pat Gelsinger in an interview.

Intel has also announced that it will change its designation for chipping technology, using names such as Intel 7, which are compatible with TMCM and Samsung.

In a smaller chip world, Intel used to use names that describe the size of features in nanometers. But over time, the names used by chamberlain makers have become random symbols, said Dan Hutsen, CEO of VLSIresearch, an independent semiconductor forecasting company. He said this has led to a misconception that Intel is not competitive.

Intel’s first major customers will be Qualcomm and Amazon. Quelcom Intel, which oversees chips for mobile phones, uses the 20A chipmang function, which uses new transistor technology to help reduce the amount of power the chip consumes.

Amazon, which is developing its own data center chips for Amazon Web Services, does not yet use Intel chipseting technology but uses IT packaging technology, and the process of collecting chips and chips, usually storing them. Called 3D formation. Analysts say Intel is superior to this packaging technology.

“With these first two clients and many others, there were many, many hours of in-depth and technical involvement,” Gelstinger said.

Although Gelsenger announced at the time of the news that the Quell Agreement was a “major mobile platform” and “in a strategic way,” Intel did not say how much the customer would win or how much it would produce. Qualcomm has a long history of using multiple base partners, sometimes even for the same chip.

After years of delays by former CEO Brian Krishnich, the big question facing Intel is whether technology can deliver on its promise. In recent weeks, Intel has announced the launch of a new data center chip called Sapphire Rapids.

But David Canter, a real-world technology analyst, says Intel is becoming more cautious. The years of delays have been partly due to Habris’s ability to solve many technical problems in a generation of technology.

At the same time, Intel said it would be able to introduce five generations of technology in four years, solve minor problems and not introduce new EUV technology in the upcoming Intel 18A process.

“In the next few years, Intel will be fully integrated with TMS and will move forward,” said Canter. In fact, Anel has people who spend all their time trying to figure out how to deploy juice and new technologies.

Report by Stephen Nellis of San Francisco; Edited by David Gregory

Our Standards: Thomson Reuters Trusted Principles.


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