Milpitas, CA, October 26, 2021 (Globe News) – Milpitas, California, October 26, 2021 – James Huang, Vice President of R&D, sees Alchip Technologies as a cost-effective extension of the Chiplett revolution.
At the TSMC 2021 Open Innovation Forum, Mr. Huang Chipsts said he will present a competitive cost structure with monolithic sockets while maintaining reasonable performance and energy consumption.
Huang mentions two technologies that are critical to chipboard development: one is TSMC 3DFabric and CoWos® combined technologies. Another Alchip Epic link is death-to-death I / 0.
APLink die-to-die (D2D) I / 0 allows high-speed data traffic between multiple chips. Epilinink 1.0 targets TSMC’s 12nm process and Eplinkink 2.0 targets the 7nm process. APLink 3.0 is currently reviewing test chip results by achieving the target line size. APLink 1.0 and 2.0 line values are 1 GB per second and 4 GB per second respectively.
Beyond where we are now, Huang has given the audience the maximum for what is to come. He described what he described as APLink 4.0, showing a 3 nm D2D IP.
APLink 4.0’s interconnect topology works with a source-synchronized I / O bus with standard core voltage. The IP is powered by a PHY macro at 12 Tbps, up to 16Gbps at the DQ line, but only with a 5 nano delay. Taken together, this brings reliable system performance.
APlink 4.0 IP supports a balanced PHY alignment that reduces both North / South and East / West directions and D2D wire length.
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“But this is a dynamic business model that will be more in line with future technological innovation needs,” Huang pointed out.
When implemented, Alchip’s customer engagement model provides introductory points on product specifications, SOS designs and systems entry points.
Go to www.alchip.com for more information.
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About Alchip
Headquartered in Alpine Technologies Limited, Taipei, Taiwan, is a supplier of silicone design and production services for systems companies building complex and large-scale ASICs and SoCs. The company was founded in 2003 by Semiconductor Patriots from Silicon Valley and Japan and offers fast-paced and cost-effective solutions for SOS Design with advanced and advanced 7nm processes. Customers include global leaders in the categories of AI, HPC / Supercomputer, mobile phones, entertainment equipment, network equipment and other electronic products. Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661) and is a TSMC certified value chain collector.
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Chuck Byers Alchip Technologies + 1-408-310-9244 chuck—byers@alchip.com
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